Bond characherization between concrete substrate and repairing materials

Ramezanianpour, A.A.; Shahhosseini, V.; Nilforoushan, A.

doi:10.22061/tej.2006.1244

Document Type : Original Research Paper

Authors

¹ Department of Civil Engineering, Amirkabir University of Technology, Tehran,Iran

² Construction Engineering and Management, Amirkabir University of Technology Tehran,Iran

³ Construction Engineering and Management, Amirkabir University of Technology , Tehran,Iran

https://doi.org/10.22061/tej.2006.1244

Abstract

The purpose of this investigation was to study the effect of bonding behavior of concrete substrate and repair materials. Three different cementitious or modified-cementitious repair materials and three surface roughnesses were studied. Repair materials were ordinary mortar, modified cementitious mortar by silica fume and modified cementitious mortar by styrene butadiene rubber latex. Surface preparations were smooth surface, rough surface and epoxy resin adhesive as a bonding agent. The method used for evaluation of bond strength was pull-off test. the influence of the electrical conductivity of repairing materials was analyzed by rapid chloride permeability test. Finally, the performance of the adhesives was evaluated considering both the bond strength and electrical conductivity.
Results obtained from these tests indicated that the roughness of substrate surface has a main effect on the performance of bond between adhesives and concrete. There are not great differences in bonding strength between various repairing materials but considering electrical conductivity, modified cementitious mortars are better materials for using in corrosive environments to increase service life of repaired structures

Keywords

Main Subjects

Architecture

References

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Technology of Education Journal (TEJ)

Bond characherization between concrete substrate and repairing materials

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Volume 1, special issue
October 2006
Pages 69-76

Bond characherization between concrete substrate and repairing materials

References

References

Send comment about this article

Volume 1, special issueOctober 2006Pages 69-76

Volume 1, special issue
October 2006
Pages 69-76